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Sony and InterDigital Partner to Form Convida Wireless, Further M2M


January 03, 2013

By Rory Lidstone, TMCnet Contributing Writer


InterDigital (News - Alert) and Sony Corporation of America have today begun a joint venture which will combine the former's pioneering wireless machine-to-machine (M2M) and bandwidth management research with the latter's consumer electronics expertise. This joint venture is called Convida Wireless and will focus on driving new research in M2M wireless communications, as well as other connectivity areas.


Convida Wireless actually represents collaboration with Sony and InterDigital Solutions, a new unit of InterDigital that was announced in October as part of the company's strategy going forward. InterDigital Solutions is meant to explore new engagement models with industry players, such as Sony.

The terms of the agreement dictate that both parties are to contribute funding and resources for additional M2M research and platform development, which will be carried out by InterDigital Solutions. Stephens Capital Partners LLC, the principal investing affiliate of Stephens Inc., will also contribute as a minority investor in Convida.

Meanwhile, this agreement also includes a patent license from InterDigital for Sony's 3G and 4G products.

"Mobile is one of Sony's core businesses, and this joint venture will help us strengthen our foundation in this important area, focusing specifically on machine-to-machine wireless technologies. Given the pioneering efforts of InterDigital's engineers in this growing field, we can't think of a better partner," said Toshimoto Mitomo, executive vice president of Entrepreneurship and Innovation at Sony Corporation of America, in a statement. "Moreover, in a market that is by its very nature collaborative, we expect Convida Wireless to be a platform for additional industry collaboration."

Indeed, InterDigital's experience with M2M research is extensive. For example, in October, the company provided standards-based gateway and server technologies to help power multivendor demonstrations and interoperability testing of wireless M2M communications at the third TC M2M Workshop hosted by ETSI in Mandelieu, France. These demonstrations helped pave the way for standards-based M2M services expected to increase adoption and drive down the cost of M2M communications.




Edited by Brooke Neuman

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